BGA Reballing Station Universal Fixed Steel Mesh Stencil Solder Aluminum Alloy Kit HT?80H

Feature: 1. Adopt aluminum alloy material as structure, light and durable 2. Used for mobile phone, chip, laptop CPU, mobile phone digital products plant tin rework with for BGA manual welding 3. This is a universal reballing fixture with all‑aluminum alloy electroplating 4. The product is not easy to oxidize, more wear‑resistant, and more suitable for 9mm to 43mm for BGA chip reballing 5. The HT‑80H reballing station is suitable for all for BGA chip reballing, regardless of rectangular or square chip Specification: Item Type: For BGA Reballing Station Product Model: HT80H Material: Aluminum alloy Uses: For BGA manual welding for cell phone, chip, laptop CPU, cell phone digital products plant tin rework. Features: For BGA universal reballing station with all aluminum alloy electroplating, not easy to oxidize, and more wearresistant. Application: Suitable for all for BGA chip ball planting, regardless of rectangular or square chip. Suitable for BGA chip reballing of approx. 9 x 9mm 0.4 x 0.4in to approx. 43 x 43mm 1.7 x 1.7in chips.. Package List: 1 x For BGA Reballing Station(5pcs removable accessories)1 x Hex WrenchAdopt aluminum alloy material as structure, light and durable Used for mobile phone, chip, laptop CPU, mobile phone digital products plant tin rework with for BGA manual welding This is a universal reballing fixture with all‑aluminum alloy electroplating The product is not easy to oxidize, more wear‑resistant, and more suitable for 9mm to 43mm for BGA chip reballing The HT‑80H reballing station is suitable for all for BGA chip reballing, regardless of rectangular or square chip