Mishima SD913 Thermal Silicone for Electronic Components: CPU, LED Bonding Paste, 1.2 W/mK Conductivity.

This high-performance thermal silicone compound is designed for efficient heat dissipation in electronic components. With a thermal conductivity of 1.2 W/mK, it ensures optimal thermal management for CPUs, LEDs, and other heat-sensitive devices. The bonding paste is easy to apply, providing a reliable and durable connection that enhances the longevity and performance of your devices. Ideal for both professionals and hobbyists, it offers superior thermal transfer capabilities, making it a crucial component in any electronic assembly or repair toolkit. Curing time: 24H Curing method: Room temperature curing Function: Adhesion, Thermal Conductivity, Fixation Aperture: Fine-pore silicone Manufacture country: China Instructions included: No