Mobile Phone Repair Fixture: Dual-Axis IC Glue Removal Clamp, Heat-Resistant BGA Chip and Circuit Board Holder.

This versatile tool is designed for precision in mobile phone repair work, featuring a dual-axis clamp that securely holds IC components and circuit boards in place. With a focus on safety and efficiency, it is heat-resistant, making it ideal for BGA chip repair and IC glue removal processes. The clamp ensures stability and accuracy during delicate repair tasks, making it an essential tool for technicians working on intricate electronic components. Material: Blackstone Specification: 18.5*8.9 cm Manufacture country: China Instructions included: No