HP Silicone Thermal Conductive Paste is a flexible, white paste that ensures effective heat dissipation in electronic and electrical devices.
Advantages and unique features
• High thermal conductivity ≥ 1.5 W/mK for optimal cooling
• Resistance to a wide temperature range from -50 °C to 250 °C
• Non-conductive - full safety of electronic systems
• Resistance to moisture, oxidation, acids, alkalis, salts, SO₂ and ammonia
• Flexible, non-flowing consistency for easy application
Properties and applications
• Appearance: white paste with a density of ~2.1 g/cm³ (20 °C)
• Thermal impedance: < 0.227 °C in²/W
• Operating range: from −50 °C to 250 °C
• No air saturation: low evaporation (0.001 %) and bleeding (0.05 %)
• Application: modules with high conductivity coefficient, CPU/GPU cooling systems, LED diodes, HDD/SSD, consumer electronics, air conditioners, automotive electronics
Parameter | Value
Thermal conductivity | ≥ 1.5 W/mK
Density (20 °C) | ~ 2.1 g/cm³
Operating temperature range | −50 °C … 250 °C
Thermal impedance | < 0.227 °C in²/W
Evaporation | 0.001 %
Bleeding | 0.05 %
Tixotropic index | 380 ± 10
Dielectric permittivity εr | 7.2 – 7.7
Shelf life | 3 years
Store in a tightly closed container in a dry, cool and well-ventilated place, away from direct sunlight.
Color: nan
Size: 100g
No-delivery refund
