Phone Tin Reballing Stencil Half Engraving Process CPU Tin Planting Template Net for A53 Series

Feature: 1. Applicable Models: CPU tin plating stencil is applicable to A53 and for A536 series with 0.12mm pitch. 2. Fast Tin Plating Speed: Our tin reballing stencil will not change under high temperature and fast tin plating speed, so that the efficiency of tin plating can be improved. 3. Half Engraving Process: The tin stencil is equipped with multiple IC recess on the stencil body with half engraving process, which effectively prevents small IC from sticking to tin and protecting small IC from breaking corners. 4. Precise Positioning: Tin plating stencil can be precisely positioned and has a compact appearance, allowing you to use it in different situations. 5. Easy to Use: CPU tin plating stencil is very portable, you can do it on the go, easy to use, is a good maintenance and DIY tools. Specification: Item Type: Phone Tin Reballing Stencil Material: Stainless steel Pitch: Approx. 0.12mm 0.005in Applicable Models: Suitable for A33 A53 A536 A13 A21S F13 M33, etc.. Package List: 1 x Phone Tin Reballing StencilApplicable Models: CPU tin plating stencil is applicable to A53 and for A536 series with 0.12mm pitch. Fast Tin Plating Speed: Our tin reballing stencil will not change under high temperature and fast tin plating speed, so that the efficiency of tin plating can be improved. Half Engraving Process: The tin stencil is equipped with multiple IC recess on the stencil body with half engraving process, which effectively prevents small IC from sticking to tin and protecting small IC from breaking corners. Precise Positioning: Tin plating stencil can be precisely positioned and has a compact appearance, allowing you to use it in different situations. Easy to Use: CPU tin plating stencil is very portable, you can do it on the go, easy to use, is a good maintenance and DIY tools.