BGA Reballing Stencil Accurate Positioning Fast Tin Planting CPU Reballing Template for S21 S21+ S21 Ultra Series

Feature: 1. [Applicable CPU] This CPU reballing stencil is applicable for Qualcomm Snapdragon 888, for SM8350, for xyn2100 CPU. 2. [Suitable Model] This BGA reballing template is suitable for S21 S21+ S21 Ultra series, for G998U G996U Z Flip3 Z Fold3 W 22, etc. phones. 3. [Anti Sticking] With multiple IC slots on the body, which effectively prevent small IC from sticking tin and breaking corners. 4. [Precise Positioning] Precisely made, the reballing template will accurately locate the CPU, with fast tin planting speed and high efficiency. 5. [Stainless Steel Material] Made from stainless steel, the reballing stencil is high temperature resistant, will not easily deform. Specification: Item Type: BGA Reballing Stencil Material: Stainless Steel Spacing: 0.12mm Applicable CPU: For Qualcomm Snapdragon 888, for SM8350, for xyn2100 CPU Applicable Models: For S21 S21+ S21 Ultra series, for G998U G996U Z Flip3 Z Fold3 W 22, etc.. Package List: 1 x BGA Reballing Stencil